Senior Integrated Sensor Circuit Design Engineer

  • Working area: R&D
  • Facility: Landshut (Germany)
  • Job time: Full Time

The Senior Integrated Sensor Circuit Design Engineer provides excellent state of the art analog IC design support and executes Integrated Sensor Product developments in line with specification, schedule and quality requirements. He/She supports LFoundry Sensor Product Line development strategy and roadmap. The position includes the coordination of a Sensor IC Design team and the planning and management of projects assigned to this team.

Integrated Sensor IC design
·    To support the LFoundry Sensor Business Unit in the areas of Integrated Sensor IC design, semiconductor process selection, IP choice, Sensor architecture and technology as well as Product volume test, qualification, certification and application related items
·   To conduct technical feasibility analysis, estimation of task duration and assessment of potential risk of the intended Product development, based on own background knowledge and on publicly available technical documentation and literature in order to contribute to the Product definition, specification and state-of-the-art implementation at best performance, fastest execution time, least risk and lowest volume production cost
·   To keep in mind potential infringements of 3rd party IP and patent rights and involve supervisor and LFoundry patent management in case of any doubt
·   To execute Product design related tasks assigned by the supervisor according to the technical targets and the timeline set for the task
·   To develop and provide all Product deliverables, views and models as requested by the supervisor
·   To report immediately to the supervisor any issue, problem or risk occurring during the task execution
·   To report professionally and on a regular base task progress, achievements, issues and any relevant risk which potentially endangers the execution of the task according to the agreed specification and time
·   To ensure Product robustness versus process spread, environment condition variations, aging, ESD/EMC conditions and all thinkable use cases by application of appropriate design flows and methodologies including corner analysis, statistical simulations, noise considerations, system simulations and aging simulations as far as necessary or appropriate in the special case
·   To present the Product characteristics to the Product requestor and to external customers if requested by the supervisor
·   To lead and guide an Integrated Sensor IC design team by executing professional project management of the assigned Product design projects and by providing technical advice to the design team in the area of Integrated Sensor IC design area
Research trends
·   To research, assess, observe and report to supervisor application needs, new requirements, competition evolution and major trends in the relevant market
·   To communicate proactively to supervisor when new technical trends or requirements are visible and propose improvements or innovations

Product quality, conformance and reliability
·   To execute and document all activities needed in order to ensure that the development process and all corresponding Product deliverables pass LFoundry R&D and QA criteria and relevant ISO standards
·   To ensure manufacturability, testability, robustness, reliability and functional safety of the Product subject to the assigned tasks by application of Design for Test (DfT) and Design for Manufacturing (DfM) methodologies and execution of corner, statistical, aging and environmental simulations as well as application of Functional Safety Analysis and Planning in case this is needed for the Product
·   To contribute to failure analysis and root cause debugging on developed Product in case of production or quality issues, customer returns or complaints

·  Master degree, Diploma or PhD in Electronic Engineering or comparable discipline
·  Several years (ideally > 10) professional experience in the following disciplines: Integrated Sensor IC design (ideally Magnetic Sensors), verification, lab measurement, package development, wafer and packaged IC test, with focus on analog and mixed signal Sensor systems
·   Good technical understanding of silicon process technology and its manufacturing and the interaction between process and device performance
·   Experience in Automotive and Industrial applications and chip developments and their particular requirements and applicable standards.
·   Background and hands-on experience in state-of-the art EDA tools such as Cadence, Synopsys, Mentor, TCAD (desirable)
·   Knowledge and application of the concepts of risk analysis and FMEA (Failure Mode and Effect Analysis)
·   Ability to work efficiently along professional development methodologies and processes and procedures which are required in order to comply with standards such as ISO9001 or IATF16949 and others
·   Hands-on experience in using common IT operating systems such as LINUX, DOS, WINDOWS and related software
·   Knowledge on basic lab equipment and their application in IC wafer and/or chip measurement
·   Basic knowledge about statistical behavior of silicon devices due to process tolerances and their statistical modeling as well as knowledge about IC design related tools handling statistical device behavior such as statistical simulation and design methodologies aiming at counter acting potential IC issues resulting from statistical device behavior
·   Knowledge and application of project management techniques and execution of relevant project tasks
·   Basic knowledge and skills in problem solving and the application of related tools  
Soft Skills 
The following soft skills are required:
·   Teamwork and Networking
·   Problem Solving
•   Time Management
•   Proactivity and resilience
•   Decision making
•   Customer focus  

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