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  2. Challenge

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  3. Transforming

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Shift Lead Engineer

  • Working area: Semiconductor Manufacturing Fab (Solid State IC Production and Development)
  • Facility: Avezzano (Italy)
  • Job time: Full Time

LFoundry is looking for Shift Lead Engeener. The working area of employment is our Semiconductor Manufacturing Fab (Solid State IC Production and Development). People in this position work with the Leaders of the Diffusion engineering and production module and will be involved in some of the activities listed below:
Analyzing the frequent ways of failure (related to the technology of area) in order to implement preventive actions or corrective actions (included maintenance structures);
Measuring the action’s effectiveness using monitoring systems. Consequently update the FMEAS of the equipments;
Evaluating, supporting and defining plans to improve assets and/or their performances;
Developing process in order to integrate new technologies and/or to improve product performances;
Supporting studies of feasibility in order to realize new technologies introduction;
To take part in inter- functional teams in order to truck the device lifecycle (process area related);
Preparing the RFQ in order to introduce new machines;
Collaborating with OEM and planning the continuous improvement actions (CIP);
Considering the department’s needs then define the Service Contracts with vendors/contractors;
To be the Area main technique contact;
Performing systematic controls and check activities in order to support continuous improvement with refer both to the single process step and the integration of them;
Establishing, build and improve SPC systems, APC/FDC systems, procedural documentations, process tracking report, quality process report, equipment performance report;
Managing people and satisfy administrative needs (as evaluation, payroll related issues in support to the dedicated team);
Planning training activities

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Equipment Technician

  • Working area: Fab: Photolithography/Dry Etch/ Thin Film/Diffusion
  • Facility: Avezzano (Italy)
  • Job time: Full Time

LFoundry is looking for Equipment Technician profile. The working area of employment is our Semiconductor Manufacturing Fab (Solid State IC Production and Development). People in this position work with the Leaders of the specific engineering and production module (Photolithography/Dry Etch/ Thin Film/Diffusion)  and will be involved in some of the activities listed below: 
To collect and analyze the equipments data To analyze the residual risk related to the process and equipments integration (FMECA/FMEA);
To conduct the failure analysis of the integration between process and equipments, if possible identifying predictive signals;
To elaborate and monitoring the KPI referred to the equipments;
To analyze the maintenance costs To verify that the critical consumable and spare parts are in inventory;
To redact the preventive maintenance procedures according to the manual of use and maintenance;
To perform actions of preventive and corrective maintenance;
To perform troubleshooting activities;
To identify the necessary parts performing PM;
To optimize the consumables;
To perform quality report about process, equipment and lots (SPC, DTS, etc.);
To collaborate in recipe management, Sigma, TIMS (APC, FDC);
To write tracking and QDR

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Change Management Engineer

  • Facility: Avezzano (Italy)
  • Job time: Full Time

LFoundry is looking for positions of Change Management Engineer. The working area of employment is our Quality and Methods Department. People in this position work in close collaboration with the leaders of Change Management area and will be involved in some of the activities listed below:
Set up and maintenance of MES (Manufacturing Execution System) to run new customer products and technologies;
Generate Production and Production support process flows following standards;
Ensure correct  process step data collection and area assignment setup, maintaining lot data process;
Accept, review, edit, route and approve the request in a timely and accurate manner;
Maintain and update procedures assigned to the Change Management Team;
Approve and/or edit customer request on the dedicated web interface;
Generate reports on all applications in use on the Change Management Area;
Determine BKMs (Best Known Methods), share them with the Team;
Organize tasks for the maximum efficiency, identifying resources needed;
Regularly make suggestions to reduce errors;
Generate alternative solution when necessary;
Monitor and drive towards system naming, procedures and system setup;
Use tools and techniques data analysis in order to analyze advanced level problem;
Apply problem solving methodologies in case of medium level problem

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Process Engineer/Equipment Engineer

  • Working area: Semiconductor Manufacturing Fab (Solid State IC Production and Development)
  • Facility: Avezzano (Italy)
  • Job time: Full Time

LFoundry is looking for positions of Process Engineer/Equipment Engineer. The working area of employment is our Semiconductor Manufacturing Fab (Solid State IC Production and Development). People in this position work with the Leaders of the specific engineering and production module and will be involved in some of the activities listed below:
To analyze process variables performance;
To analyze related product performances;
To apply "problem solving", "data analysis" e "data mining" techniques in order to identify and to characterize main failures
To analyze the frequent ways of failure (related to the technology of area) in order to implement preventive actions or corrective actions (maintenance structures included).
To measure the action  effectiveness using monitoring systems. Consequently update the FMEAS of the equipment;
To evaluate, support and define plans to improve assets and/or performances;
To develop process in order to integrate new technologies and/or to improve product performances;
To support studies of feasibility in order to realize new technologies introduction;
To take part in inter- functional teams in order to truck the device lifecycle (process area related);
To support other functions in order to facilitate the new process flow introduction and/or process transfer activities;
To perform systematic control and check activities in order to support continuous improvement with refer to both the single process steps and the integration among them;
Establish, build and improve SPC systems, APC/FDC systems, procedural documentations, process tracking report, quality process report, equipment performance report.

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Thesis - Implementation and evaluation of structures and tecniques for parametric measurement in parallel

  • Facility: Avezzano (Italy)
  • Job time: Thesis

Objective
Evaluate measurement tecniques to realize a routine library for parallel test (HP BASIC or C++) on HP4062 and Keithley S600, analyze the interaction between the layout and the test structure to be used for parallel test.
Required knowledge: 
electrical measurements, programming tecniques, device physics
Preferential Requirement
knowledge of HP basic/C++ programming languages 
Duration
 6+ months
Start
2017

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Thesis- Development of an automatic measurement system for the execution of Reliability Tests on semiconductor devices

  • Facility: Avezzano (Italy)
  • Job time: Thesis

The wafer level reliability (WLR) laboratory performs accelerated reliability tests of semiconductor devices as part of the technological qualification of a product. Furthermore, the laboratory performs periodical tests as monitor of the production line to reduce the probability that deviant material arrives to the final customer.
There are three main portions of the technology process that are evaluated by WLR tests:
1. Device reliability is assessed by Hot Carrier Injection (HCI) and Bias Temperature Instability (BTI) tests
2. Gate Oxide Integrity is assessed by Time Dependent Dielectric Breakdown (TDDB) and Voltage ramp (V-ramp) tests
3. Metal Interconnects are assessed by Electromigration (EM), Stress Migration (SM), and Inter Layer Dielectric (ILD) TDDB
The execution of accelerated reliability testing requires a large amount of electrical measurements to monitor over time the characteristics of the various devices under stress. For this purpose are used machines and tools (Prober and Testers) that allows to perform electrical measurements automatically.

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Device Modeling Engineer

  • Facility: Landshut (Germany)
  • Job time: Full Time

The Device Modeling Engineer develops the models for the simulation of the device behavior that allow the analog and/or digital designer to verify the functionality of his circuit under different conditions. The main activities of the device modeling engineer are the definition of test structures, the preparation of measurement instructions, the analysis, interpretation and processing of measurement data and the extraction of model parameters and subsequent implementation to the appropriate model structure. The final model has to be prepared fitting the PDK (process design kit) and it has to include all required and available parameters (e.g. Monte Carlo, Mismatch, Noise, Corners, etc…). A high level of quality awareness during the comparison of measurement data versus simulation results and a frequent verification of the actual values in the context of the device specification and EDR (electric design rules) are strongly required. Furthermore the daily business includes the communication and interaction with the process and technology departments, the PDK team and the technical support for customers and IP partners.

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STAGE - Chemical Laboratory

  • Facility: Avezzano (Italy)
  • Job time: Stage

Study on analytical recovery capability for metal elements from silicon wafer surface by VPD/ICP-MS
Optical performances of CMOS imagers can be affected by contamination caused by several elements found, even if in extremely low concentration, in semiconductor production environment. In particular, contamination by noble elements like, for example, Gold or Silver, is extremely critical since these elements have a very low migration rate in the silicon, so they are not easily segregated into the gettering sites. They remain electrically active, and contribute to the so called “hot pixel” defects. Unfortunately, the noble elements are also very difficult to be effectively detected by VPD/ICP-MS, the technique traditionally and successfully used to detect most of the other elements (like Fe, Cr, Ni, Na, Ca...). In fact, the chemical mixtures typically used to dissolve noble metals (like Aqua Regia) are very aggressive to the silicon substrate as well, damaging the wafer surface and making recovery by the automated equipment used for this technique (VPD) very difficult and not reliable. In order to allow the implementation of routine analysis for the full elemental range of interest, alternative chemistries should be defined (through theoretical modeling and analytical test confirmation), capable to assure acceptable analytical recovery for noble elements and the other common elements at same time.

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STAGE - Chemical Laboratory

  • Facility: Avezzano (Italy)
  • Job time: Stage

Characterization of VOC contamination in fab c/r environment, and subsequent set-up of a monitoring methodology and strategy
VOC (Volatile Organic Compounds) may affect semiconductor production yield by defect generation (e.g. in ECP process) or damaging the lens coating of photolithography production equipment. VOC concentration and composition in the fab c/r environment depends on internal and external sources, which may change for seasonal reasons as well. A characterization of the contamination is necessary to establish the most effective methodology and strategy for VOC monitoring.

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